Thermal Management Handbook: For Electronic Assemblies

Thermal Management Handbook: For Electronic Assemblies

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In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges a€” and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage a€” and preventing thermal-related problems from occurring in the first place.W. D. Callister Jr., Materials Science and Engineering a€” An Introduction, Johu Wiley aamp; Sons, New York, 199L 7. J. E. Sergent and G. Marks, -The Electroformed Stencil: A Solution for Fine Pitch Solder Printing.- Proceedings ISHM Symposium ... ITI Ferro Tec, Techaical Reference ManuaL 25. Melcor, Techaical Referenceanbsp;...

Title:Thermal Management Handbook: For Electronic Assemblies
Author: Jerry Sergent, Al Krum
Publisher:McGraw Hill Professional - 1998

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